Electronics Epoxy 

Description

GL 614 is a one-part white adhesive based on epoxy resins.  It cures fast at elevated temperatures and has excellent adhesion to most pc boards and electronic components.  It may be cured at 100ºC or faster at 175ºC.  It has no sagging.  It has a stable pot life and long shelf life even at room temperature of 25ºC.  It has been designed especially for bonding electronic components.  It has relatively low viscosity for faster dispense from syringes. It has high thixotropic which can control the flow of the adhesive. 

Applications 

1. Epoxy adhesive for attaching to ceramic, metals, and most plastics in electronics. 

Guidelines for Use 

1. Thaw the epoxy to room temperature (25ºC) before use. 

2. Dispense the epoxy by using a syringe. 

3. Wipe off any excess uncured adhesive with a piece of dry cloth or tissue.  Further cleaning may be achieved with tissue dabbed with iso-propanol.alcohol (IPA).  

4. Cure the epoxy by heating at 100ºC for 120 minutes in a convection oven. Curing at lower temperature will require a longer time.  

Properties  

Recommended Cure 

Storage 

 Tightly close original container of unused product.  Store below     -20ºC. Storing at lower temperatures down to -40ºC may prolong shelf life beyond 6 months.  However it may take longer time to thaw the product. 

Packaging

 5 ml EFD syringe 

 10 ml EFD syringe 

 30 ml EFD syringe

Environment, Health & Safety 

 This product is RoHS compliant.  It does not contain any known carcinogenic, mutagenic or teratogenic components. 

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